| Tender ID | SkillTender87 |
| Reference No. | 207/24-25/065 |
| Tender Brief | The National Skill Development Corporation (NSDC) has released an RFP for Phase 6 of the Technical Intern Training Program (TITP) |
| Tender Description | The National Skill Development Corporation (NSDC) has released an RFP for Phase 6 of the Technical Intern Training Program (TITP), seeking to empanel new Sending Organizations (SOs) in India to place Indian technical interns in Japan. This opportunity aims to bridge skill gaps by transferring Japanese industrial practices to India, enhancing employment avenues for Indian youth. |
| Pre-Qualification Criteria | Key Points:
Empanelment Benefits:Selected SOs will play a pivotal role in India’s mission to become a global skill hub, with structured support for placements and growth prospects in international markets. |
| Tender Fee (Number) | 200000 non-refundable |
| EMD (Number) | Annual non-refundable LICENSE Fee of INR 1,00,000 |
| Mode of EMD | Online |
| Estimated Cost | NA |
| Start Date of Document Collection | NA |
| Pre-Bid Meeting Date | NA |
| Last Date for Submission | 31/03/2025 |
| Opening Date | NA |
| Download the Document | View Document |